Description: This XL-BGA HDI Test Vehicle PCB is a high-density interconnect board developed for advanced BGA package evaluation and manufacturing process validation. Featuring a large 152 × 152 mm test area and an extensive fine-pitch BGA pad array, the board is designed to evaluate high-density interconnection, SMT assembly, solder paste printing, reflow soldering, solder joint reliability, PCB warpage, and thermal performance. The HDI structure enables compact routing and precise signal interconnection in areas with extremely high component density, making the board suitable for semiconductor package evaluation, advanced electronics manufacturing, process development, and reliability testing. LJPCB provides professional bare HDI PCB manufacturing services, including multilayer PCB fabrication, high-density interconnect (HDI) technology, fine-pitch BGA pad fabrication, surface finishing, impedance control, and customized PCB solutions.
| Layer | 4L | Material Thickness | 3.23mm |
|---|---|---|---|
| Surface Finishing | ENIG 1U" | Finished Copper Thickness | 1OZ |
| Solder Mask | Black | Legend Mark | white |
| Material | FR-4 TG180 | Test | Flying Probe Test |
| Special Item: | via holes with resin,HDI(L1-L2 L1-L3) |