Description:  This 8-layer HDI PCB is designed as a validation board for the Renesas RZ/N1S industrial Ethernet MPU platform. It features high-density interconnect technology and a complex multilayer layout to support high-speed signal routing, power management, debugging and various industrial communication interfaces. The board is intended for hardware validation, software development and industrial Ethernet application evaluation, including PLCs, industrial gateways, remote I/O and network communication equipment. LJPCB provides professional HDI PCB manufacturing services, including 8-layer HDI PCB fabrication, fine-line processing, microvia technology, high-density component interconnection, surface finishing and customized PCB solutions for advanced industrial electronics.

Layer	8L	Material Thickness	2.0mm
Surface Finishing	ENIG 2u"	Finished Copper Thickness	2oz
Solder Mask	Green	Legend Mark	White
Via	Resin Plug Hole	Test	Flying Probe