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Multilayer Board Of The Mainstream Manufacturing Method
May 31, 2017

Multilayer board production methods generally by the inner layer of the first to do, and then printed etching method made of single or double-sided substrate, and into the specified layer, and then by heating, pressure and be bonded, as for the The drilling is the same as that of the double panel. These basic methods of production and the 1960s did not change much of the law, but with the material and process technology (such as: bonding bonding technology to solve the drilling when the glue residue, film improvement) more mature, attached to more The characteristics of the board are more diverse.

The multilayer board was disclosed by three methods of Clearance Hole, Build Up and PTH. Since the gap hole method is very laborious in manufacturing, and the high density is limited, it is not practical. Because of the complexity of the manufacturing method, coupled with the advantages of high density, but because of the high density of demand is not as urgent, has been obscure; Seoul near because of the demand for high-density circuit board, once again become the Home manufacturers R & D focus. As for the same process with the double-sided PTH method, is still the mainstream of multi-layer manufacturing method.

With the VLSI, electronic components of the miniaturization, high accumulation of progress, multi-layer board with high-direction circuit with high-direction forward, so the demand for high-density lines, high wiring capacity Yiyin, also associated with the electrical Characteristics (such as Crosstalk, the integration of impedance characteristics) more stringent requirements. The popularity of the multi-foot part and the surface mount component (SMD) makes the shape of the circuit board pattern more complex, the conductor lines and the smaller pore size, and the development of high Multilayer Board (10 to 15 layers) The The latter half of the 1980s, in order to meet the needs of small, lightweight high-density wiring, small hole trend, 0.4 ~ 0.6 mm thick thin Multilayer Board is gradually popular. Punch processing to complete the parts of the hole and shape. In addition, a small number of diverse production of products, the use of photoresist to form a pattern of photography.

High-power amplifier - substrate: ceramic + FR-4 plate + copper base, layer: 4 layer + copper base, surface treatment: immersion gold, features: ceramic + FR-4 plate mixed laminated, with copper-based crush.

Military high-frequency multi-layer board - substrate: PTFE, thickness: 3.85mm, the number of layers: 4 layers, features: blind buried hole, silver paste filling.

Green material - substrate: environmental protection FR-4 plate, thickness: 0.8mm, the number of layers: 4 layers, size: 50mm × 203mm, line width / line distance: 0.8mm, aperture: 0.3mm, surface treatment: Shen tin.

High frequency, high Tg device - substrate: BT, the number of layers: 4 layers, thickness: 1.0mm, surface treatment: gold.

Embedded system - substrate: FR-4, the number of layers: 8 layers, thickness: 1.6mm, surface treatment: spray tin, line width / line distance: 4mils / 4mils, solder resistance color: yellow.

DCDC, power module - substrate: high Tg thick copper foil, FR-4 sheet, size: 58mm × 60mm, line width / line distance: 0.15mm, pore size: 0.15mm, thickness: 1.6mm, , Surface treatment: immersion gold, features: each layer of copper foil thickness of 3OZ (105um), blind buried hole technology, high current output.

High-frequency multi-layer board - substrate: ceramic, the number of layers: 6 layers, thickness: 3.5mm, surface treatment: immersion gold, features: buried hole.

Photoelectric conversion module - substrate: ceramic + FR-4, size: 15mm × 47mm, line width / line distance: 0.3mm, aperture: 0.25mm, the number of layers: 6 layers, thickness: 1.0mm, surface treatment: Goldfinger, features: embedded positioning.

Backplane - substrate: FR-4, number of layers: 20 layers, thickness: 6.0mm, outer copper thickness: 1/1 ounce (OZ), surface treatment: immersion gold.

Micro modules - substrate: FR-4, number of layers: 4 layers, thickness: 0.6mm, surface treatment: immersion gold, line width / line distance: 4mils / 4mils, features: blind hole, semi-conductive hole.

Communication base station: FR-4, the number of layers: 8 layers, thickness: 2.0mm, surface treatment: spray tin, line width / line distance: 4mils / 4mils, features: dark solder resistance, multi-BGA impedance control.

Data acquisition - substrate: FR-4, the number of layers: 8 layers, thickness: 1.6mm, surface treatment: immersion gold, line width / line distance: 3mils / 3mils, solder resistance: green matte, features: BGA , Impedance control.


Longjiang Circuit International Limited