1, Single Side Board cutting CCL; (will be covered with copper plate for cutting, pay attention to cutting specifications, before cutting the need to bake sheet);
2, grinding plate; (in the mill inside the cutting of the CCL cleaning, so that the surface without dust, burrs and other debris, the first grinding after baking, two processes are one);
3, printed circuit; (in a copper side printed on the circuit diagram, the ink has anti-corrosion effect)
4, Single Side Board inspection; (the excess ink will be removed, the ink will be less ink to fill the ink, if found a lot of bad, need to be adjusted, bad products can be placed in the second step in the etching ink cleaning, clean and dry back This process re-processing)
5, ink to be dry;
6, etching; (with the reagent will be excess copper corrosion, with ink on the circuit to retain the copper, and then use the reagent to clean the ink on the circuit and then drying, the three processes are one)
7, Single Side Board drill positioning hole; (after etching the drill hole positioning hole)
8, grinding plate; (the hole will be drilling holes for cleaning and drying, and 2 substrate)
9, silk screen; (in the back of the substrate printed on the plug-in components silk screen, some marked code, silk screen after drying, two processes are one)
10, grinding plate; (and then a clean)
11, resistance welding; (in the cleaning of the substrate after the screen printing green oil solder resist, the pad does not need green oil, printed directly after drying, two processes are one)
12, molding; (with punch molding, no V pit treatment may be divided into two times, such as small round plate, starting from the silk surface to the solder surface into a small round plate, and then from the solder surface to the silk surface red Plug holes, etc.)
13, V pit; (small disc without V pit processing, the machine will be cut off the board with a sub-slot)
14, rosin; (first grinding board, clean the substrate dust, after drying, and then coated with a layer of thin layer of rosin, the three processes are one)
15, Single Side Board FQC test; (test whether the deformation of the substrate, hole, whether the line is good)
16, flattened; (deformation of the substrate flattened, the substrate is not necessary to smooth the operation of this process)
17, packaging and shipping.
Note: silk screen and welding between the grinding plate process may be omitted, you can first solder, and then silk screen, the specific situation to see the substrate.
1, print circuit Single Side Board. Will draw a good circuit board with a transfer paper to print out, pay attention to the sliding side of their own, the general print two circuit boards, that is, a piece of paper to print two circuit boards. In which to choose the best print production board.
2, cutting CCL, with a photosensitive board production circuit board full diagram. CCL, that is, both sides are covered with copper film circuit board, the CCL cut into the size of the circuit board, not too large to save material.
3, pretreatment CCL. With fine sandpaper on the surface of the copper oxide layer polished off to ensure that the transfer of the circuit board, the thermal transfer paper on the toner can be firmly printed on the CCL, polished the standard is bright, no obvious Stains.
4, transfer circuit Single Side Board. Will print a good circuit board cut into the appropriate size, printed on the side of the printed circuit board on the CCL, aligned after the CC into the thermal transfer machine, put into the paper must ensure that the transfer paper is not dislocation. In general, after 2-3 times the transfer, the circuit board can be very strong transfer on the CCL.
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