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The performance of Aluminum base PCB
Jun 08, 2018

Aluminum base PCB is the aluminum base material circuit board, made from copper foil, thermal insulation layer and the metal substrate composition, let's have a look what are the properties of Aluminum PCB.

散热性

Heat dissipation

目前,很多双面板、多层板密度高、功率大,热量散发难。常规的印制板基材如FR4、CEM3都是热的不良导体,层间绝缘,热量散发不出去。电子设备局部发热不排除,导致电子元器件高温失效,而铝基板可解决这一散热难题。

At present, the heat dissipation of many double sides PCB, multilayer sides PCB, high density and high power PCB is difficult. Printed circuit board such as FR4, CEM3 is a poor conductor of heat of conventional, interlayer insulation, heat does not go out. Local heating electronic equipment not excluded, leading to high temperature failure of electronic components, and the aluminum substrate can solve the heat dissipation problem.

Thermal expansion

热胀冷缩是物质的共同本性,不同物质的热膨胀系数是不同的。铝基印制板可有效地解决散热问题,从而使印制板上的元器件不同物质的热胀冷缩问题缓解,提高了整机和电子设备的耐用性和可靠性。特别是解决SMT(表面贴装技术)热胀冷缩问题。

Expansion and contraction is a common nature material, different material coefficient of thermal expansion is different. Aluminum base PCB can effectively solve the problem of heat, so that the printed board components of different substances to relieve the problem of thermal expansion and contraction, improve durability and reliability of the whole machine and electronic equipment. Especially the solution of SMT (surface mount technology) problem of thermal expansion and contraction.

Dimensional stability

铝基印制板,显然尺寸要比绝缘材料的印制板稳定得多。铝基印制板、铝夹芯板,从30℃加热至140~150℃,尺寸变化为2.5~3.0%。

apparently the dimensional stability of aluminum base PCB is more stable than the insulating material of PCB. Aluminum base PCB, aluminum sandwich panels, from 30 ℃ to 140~150 ℃, change in size for 2.5~3.0%.

屏蔽性

Shielding

铝基印制板,具有屏蔽作用;替代脆性陶瓷基材;放心使用表面安装技术;减少印制板真正有效的面积;取代了散热器等元器件,改善产品耐热和物理性能;减少生产成本和劳力。

Aluminum base PCB is with shielding; instead of the brittle ceramic PCB; the use of surface mount technology is more assured ; reduce the printed board truly effective area; replace the radiator components, improve product thermal and physical properties; and reducing the production cost and labor.